Guangli Technology Proposes to Issue Up to 500 Million Yuan in Scientific and Technological Innovation Bonds to Intensify Semiconductor Packaging and Testing Equipment Business

Source: Securities Daily

Staff Reporter: Xiao Yanqing

On the evening of March 12, Guangli Technology Co., Ltd. (hereinafter referred to as “Guangli Technology”) announced that, in order to actively respond to national policies on technological innovation, increase investment in technological R&D, further expand financing channels, and reduce financial costs, the company plans to apply for registration of up to 500 million RMB (including 500 million RMB) in science and technology innovation bonds with the China Interbank Market Dealers Association.

The announcement shows that Guangli Technology’s science and technology innovation bonds will be publicly issued to institutional investors in the national interbank bond market. The bonds are classified as interbank market science and technology innovation bonds, with a maturity of no more than 10 years (including 10 years). The specific interest rates and repayment methods will be determined based on market conditions at the time of issuance.

Guangli Technology’s application to issue these science and technology innovation bonds has been approved by its board of directors and is subject to approval by its shareholders’ meeting. It also requires approval from the China Interbank Market Dealers Association and will be implemented within the registration validity period after receiving the registration.

Regarding the impact of this bond issuance, Guangli Technology stated that if successful, it will help the company further broaden its financing channels, effectively improve cash flow, enhance liquidity management, and provide medium- to long-term funding support for core activities such as R&D, manufacturing, and business expansion of semiconductor packaging and testing equipment.

In response, Shen Meng, partner at Shanghai Yumei Management Consulting, told Securities Daily that this issuance of sci-tech innovation bonds is a strategic move to leverage policy benefits, supplement working capital, and especially increase investment in long-term R&D fields. It will help alleviate financing pressure and reduce financing costs. As a key strategic industry supported by national policies, the semiconductor industry has stable market expectations and demand, with strong development prospects.

Public information shows that Guangli Technology is a leading global provider of semiconductor dicing and slicing equipment. It is one of the few companies worldwide that simultaneously produces mass-production dicing equipment and core components such as air spindles and blades. Currently, Guangli Technology offers more than twenty models of mechanical dicing equipment and can provide customized solutions based on customer application scenarios.

It is understood that Guangli Technology’s domestically produced semiconductor dicing equipment has been operating at full capacity since July 2025. The company’s semiconductor business shipments have continued the growth trend since July last year, with new orders also steadily increasing.

Song Xiangqing, Vice President of the China Business Economics Society, told Securities Daily that the current semiconductor industry is characterized by accelerated advanced packaging, deeper domestic substitution, and high prosperity of equipment and materials. The packaging and testing segment has become a key breakthrough for value enhancement and independent control of the industry chain. As a rare integrated provider of semiconductor dicing equipment and core components, Guangli Technology is currently at a critical stage of R&D investment and capacity expansion, with full production and continuous order growth. The company’s issuance of no more than 500 million RMB in long-term sci-tech innovation bonds through the interbank market aligns with policy guidance, matches high industry prosperity, and is a rational choice to optimize capital structure.

(Editor: Qiao Chuanchuan)